Anritsu Precision exhibited its MK5420A SOLLEAD-MA printed solder paste inspection system equipped with next-generation sensors at the 26th Electrotest Japan show and at the 1st International Automotive Electronics Technology Expo. This new inspection system can quickly and accurately measure in three dimensions the height, volume, and surface area of printed solder paste particularly in mounting assembly lines for thin, high density printed circuit boards with cream solder specifications, and with this system, users can expect better production efficiency and improvements in production control.
The function of the scanning laser beam, which features unique technology, was reinforced to achieve double the scanning frequency per second and double the signal processing capacity for this inspection system compared to conventional systems. As a result, the measurement performance of the printed solder paste inspection system was further improved to enable measurements of ultra thin printed circuit boards with thicknesses of only 0.3mm. In addition, the new inspection system can inspect approximately 40% more M-size printed circuit boards than conventional equipment, and this increase supports ultra high speeds.
Anritsu Precision, which exhibited a prototype, has not decided on a commercial launch date, but it plans to make an official announcement at a later date. The company is targeting higher precision as its next development objective.
